MEMS Syllabus PDF

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Summary

The syllabus for MEMS...

Description

Course Name

18ECO135T

Pre-requisite Nil Courses Course Offering Department

Course Category

FUNDAMENTALS OF MEMS

Co-requisite Nil Courses Electronics and Communication Engineering

Learning

Introduction

S-1

S-2

Fabrication overview

9 Introduction to MEMS and Brief recap of SLO-1 Macro devices SLO-2 Microelectronics and Micro systems

Introduction to Micro fabrication process

SLO-1 Scaling laws in geometry

9

13

14

15

Environment & Sustainability

Ethics

Individual & Team Work

Communication

Project Mgt. & Finance

Life Long Learning

10 11

Society & Culture

9

Modern Tool Usage

8

Analysis, Design, Research

7

Design & Development

6

Problem Analysis

5

Engineering Knowledge

4

Expected Attainment (%)

3

H -

H H H H

H -

H H H -

-

H -

H -

-

-

H H H H H H

Micromachining

Bonding & Sealing

H H H H

-

H H H H H H

Recent trends

Introduction to MEMS packaging

Introduction to design tools and simulation

Significance of each technique

9 Introduction of micro machining(MMC) process Significance of MMC

Challenges in packaging

Process Description of Photolithography

Bulk MMC process – merits and demerits

Different levels of Packaging Die, device and system level

FEM analysis Design of a silicon die for a micro pressure sensor Simulation in software Application of MEMS in automotive industry

Sequence of steps

SLO-2 Cz process

Implementation, merits and demerits of CVD

Anisotropic etching

SLO-1

Process Description of PVD

Surface MMC process

Sequential steps in wafer processing

S-5

Implementation, merits and demerits of Sequence of steps PVD Chemical and mechanical properties of Si Process Description, implementation of Ion Challenges in surface MMC and compounds implantation Chemical and mechanical properties of Oxidation process Interfacial & Residual stresses Polymers, Quartz and GaAs Chemical, Biomedical type LIGA process- description merits and Diffusion process Micro sensors demerits

B.Tech-ECE

2

-

Significance of Isotropic etching

SLO-1

1

H H H H H H

Implementation of Photolithography

SLO-2

12

Program Learning Outcomes (PLO)

3

Expected Proficiency (%)

2

S-4

S-6

3

80% 80% 80% 80% 80% 80%

Process Description of CVD

SLO-1

C

0

80% 80% 80% 80% 80% 80%

SLO-1 Si wafer production

SLO-2

P

0

2,3 1,2 1 3 3 3

SLO-2 Silicon as ideal material and as substrate S-3

T

3

Level of Thinking (Bloom)

Appreciate the fundamental concepts in MEMS technology Understand the fabrication and machining techniques of MEMS devices Familiarize with the concepts of packaging of MEMS devices Appreciate the significance of micro fabrication processes Design and Simulate simple structures using MEMS software Analyze recent trends and developments in MEMS technology

Duration (hour)

L

Nil

1

Understand the importance of micro system technology Learn the operating principle of various micro sensors and actuators Impart the applications of various micro fabrication techniques Understand the differences and need for microfabrication Operate MEMS design tools to design simple micro devices Understand recent developments and challenges in MEMS

Course Learning Outcomes (CLO): At the end of this course, learners will be able to: CLO-1 : CLO-2 : CLO-3 : CLO-4 : CLO-5 : CLO-6 :

Open Elective

Progressive Nil Courses Data Book / Codes/Standards

Course Learning Rationale (CLR): The purpose of learning this course is to: CLR-1 : CLR-2 : CLR-3 : CLR-4 : CLR-5 : CLR-6 :

O

PSO 1: Automatic control for continuous& discrete systems PSO-2: Utilize PLC & DCS for control of systems PSO-3: Effective management skills

Course Code

9

Differences in IC packaging technology And MEMS packaging

Die Preparation

9

Airbag deployment Optical MEMS Application

Plastic encapsulation and its significance

Micro mirrors

Types of wire bonding Thermo compression type

Micro fluidics Application

Thermo sonic, Ultra sonic type

Lab on chip module

Types of surface bonding – Adhesive

IR and Gas sensing

SRM Institute of Science & Technology – Academic Curricula (2018 Regulations)

157

SLO-2 Piezoelectric type of Micro sensors

Wet etching methods

SLO-1 Thermal, SMA, Piezoelectric actuators

Properties of etchants

Implementation Process Design-block diagram and description

soldering, SOI type of bonding

Thermal sensors

Anodic bonding and lift off process

Micro power generation

Precautions to be taken

Micro TEG

Types of sealing- Micro shells, Hermetic sealing

Chemical sensors

S-7 SLO-2 Electro static type Micro Actuators

S-8

S-9

Micro devices- operation of Micro gears SLO-1 and micromotors Micro devices –operation of Micro valves SLO-2 and pumps SLO-1 Case study SLO-2

Learning Resources

1. 2.

Electro-mechanical design, Thermoelectric design

Dry etching methods Production of plasma

CAD- block diagram description and implementation

Etch stop methods Case study

Case study

Tai-Ran Hsu, “MEMS and MICROSYSTEMS”, 22nd reprint edition, Wiley & sons, 2015 M. Madou, “Fundamentals of Micro fabrication”, Taylor and Francis group, 2002

3. 4.

Micro ‘O’ rings,Reactive seal

Micro humidity sensors

Selection of packaging materials Material requirements

Micro pressure sensors Paper MEMS

VardhanGardener,”Micro sensors and smart devices”, John Wiley & Sons,2001 NPTEL link: https://nptel.ac.in/downloads/112108092/

Learning Assessment Bloom’s Level of Thinking

Continuous Learning Assessment (50% weightage) CLA – 2 (15%) CLA – 3 (15%) Theory Practice Theory Practice

CLA – 1 (10%) Theory Practice

CLA – 4 (10%)# Theory Practice

Remember 30 % 30 % 30 % 30 % Understand Apply Level 2 40 % 40 % 40 % 40 % Analyze Evaluate Level 3 30 % 30 % 30 % 30 % Create Total 100 % 100 % 100 % # CLA – 4 can be from any combination of these: Assignments, Seminars, Tech Talks, Mini-Projects, Case-Studies, Self-Study, MOOCs, Certifications, Conf. Paper etc., Level 1

Course Designers Experts from Industry

Experts from Higher Technical Institutions

Final Examination (50% weightage) Theory

Practice

-

30%

-

-

40%

-

-

30%

100 %

100 %

Internal Experts

1. D. Karthikeyan, Controlsoft Engineering India Pvt Ltd, [email protected]

1. Dr. J. Prakash, MIT, Chennai, [email protected]

1. Dr. A. Vimala Juliet, SRMIST

2. Mr. Hariharasudhan - Johnson Controls, Pune, [email protected]

2. Dr. D. Nedumaran, Madras University, [email protected]

2. R.Bakiyalakshmi,SRMIST

B.Tech-ECE

SRM Institute of Science & Technology – Academic Curricula (2018 Regulations)

158...