Title | LM317 DATASHEET PDF |
---|---|
Author | Diego Ytuza Peres |
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LM317 DATASHEET PDF
ИНТЕГРИРОВАННАЯ ЦЕПНАЯ ИНФОРМАЦИЯ...
OUTPUT
INPUT OUTPUT ADJUST
KCS (TO-220) PACKAGE (TOP VIEW)
OUTPUT
INPUT
KC (TO-220) PACKAGE (TOP VIEW)
OUTPUT
OUTPUT
DCY (SOT-223) PACKAGE (TOP VIEW)
INPUT OUTPUT ADJUST
ADJUST
OUTPUT
KTE PACKAGE (TOP VIEW)
KTT (TO-263) PACKAGE (TOP VIEW)
INPUT
INPUT OUTPUT ADJUST
OUTPUT ADJUST
The LM317 is an adjustable three-terminal positive-voltage regulator capable of supplying more than 1.5 A over an output-voltage range of 1.25 V to 37 V. It is exceptionally easy to use and requires only two external resistors to set the output voltage. Furthermore, both line and load regulation are better than standard fixed regulators. In addition to having higher performance than fixed regulators, this device includes on-chip current limiting, thermal overload protection, and safe operating-area protection. All overload protection remains fully functional, even if the ADJUST terminal is disconnected. The LM317 is versatile in its applications, including uses in programmable output regulation and local on-card regulation. Or, by connecting a fixed resistor between the ADJUST and OUTPUT terminals, the LM317 can function as a precision current regulator. An optional output capacitor can be added to improve transient response. The ADJUST terminal can be bypassed to achieve very high ripple-rejection ratios, which are difficult to achieve with standard three-terminal regulators.
PowerFLEX™ – KTE
Reel of 2000
LM317KTER
Tube of 80
LM317DCY
TO-220 – KC
Reel of 2500 Tube of 50
LM317DCYR LM317KC
TO-220, short shoulder – KCS
Tube of 20
LM317KCS
TO-263 – KTT
Reel of 500
LM317KTTR
SOT-223 – DCY 0 C to 125 C
(1) (2)
LM317 L3 LM317 LM317
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerFLEX, PowerPAD are trademarks of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Copyright © 1997–2007, Texas Instruments Incorporated
over virtual junction temperature range (unless otherwise noted) VI – VO
Input-to-output differential voltage
TJ
Operating virtual junction temperature
150
C
Lead temperature 1,6 mm (1/16 in) from case for 10 s
260
C
150
C
Tstg (1)
(1) (2)
2
40
Storage temperature range
–65
V
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
PowerFLEX™ (KTE)
High K, JESD 51-5
23 C/W
3 C/W
SOT-223 (DCY)
High K, JESD 51-7
53 C/W
30.6 C/W
TO-220 (KC/KCS)
High K, JESD 51-5
19 C/W
17 C/W
3 C/W
TO-263 (KTT)
High K, JESD 51-5
25.3 C/W
18 C/W
1.94 C/W
Maximum power dissipation is a function of TJ (max), JA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ (max) – TA)/ JA. Operating at the absolute maximum TJ of 150 C can affect reliability. For packages with exposed thermal pads, such as QFN, PowerPAD™, or PowerFLEX™, JP is defined as the thermal resistance between the die junction and the bottom of the exposed pad.
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VI – VO
Input-to-output differential voltage
IO
Output current
TJ
Operating virtual junction temperature
3
40
V
1.5
A
0
125
C
TJ = 25 C
0.01
0.04
TJ = 0 C to 125 C
0.02
0.07
over recommended ranges of operating virtual junction temperature (unless otherwise noted)
Line regulation (2)
VI – VO = 3 V to 40 V CADJ = 10 F, (3) TJ = 25 C
Load regulation
IO = 10 mA to 1500 mA TJ = 0 C to 125 C
Thermal regulation
20-ms pulse,
VO
5V
25
mV
VO
5V
0.1
0.5
%VO
VO VO
5V 5V
20 0.3
70 1.5
mV %VO
0.03
0.07
%VO/W
50
100
A
0.2
5
A
1.25
1.3
V
TJ = 25 C
ADJUST terminal current Change in ADJUST terminal current
VI – VO = 2.5 V to 40 V, PD
Reference voltage
VI – VO = 3 V to 40 V, PD
Output-voltage temperature stability
TJ = 0 C to 125 C
Minimum load current to maintain regulation
VI – VO = 40 V
Maximum output current
3.5
15 V,
PD < PMAX
40 V,
PD < PMAX
(4),
VO = 10 V,
Long-term stability
TJ = 25 C
1.2
0.7
VI – VO
Ripple rejection
(2) (3) (4)
20 W, IO = 10 mA to 1500 mA
VI – VO
RMS output noise voltage f = 10 Hz to 10 kHz, (% of VO)
(1)
20 W, IO = 10 mA to 1500 mA
(4)
TJ = 25 C
1.5
2.2
0.15
0.4
TJ = 25 C f = 120 Hz
%/V
%VO 10
A
0.003 CADJ = 0
F (3)
CADJ = 10 F (3)
%VO
57 62
dB
64 0.3
mA
1
%/1k hr
Unless otherwise noted, the following test conditions apply: |VI – VO| = 5 V and IOMAX = 1.5 A, TJ = 0 C to 125 C. Pulse testing techniques are used to maintain the junction temperature as close to the ambient temperature as possible. Line regulation is expressed here as the percentage change in output voltage per 1-V change at the input. CADJ is connected between the ADJUST terminal and GND. Maximum power dissipation is a function of TJ (max), JA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ (max) – TA)/ JA. Operating at the absolute maximum TJ of 150 C can affect reliability.
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3
1.4
10.01 T A =25°C T A = –40°C
1.2
10.005
T A = –40°C
1
10
0.8 V OUT – V
V OUT – V
T A =25°C
9.995 T A =125°C
9.99
0.6 0.4 T A =125°C
0.2 0
9.985 -0.2
VOUT =10VNom
V OUT =V REF
-0.4 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4
0.8 0.9 1 1.1 1.2 1.3 1.4 1.5
IOUT – A
IOUT – A
11
10.4
-1.5
9.6
-4
9.4
-4.5
9.2 CADJ =0µF
70
60
50
40
30
20
0
10
-10
-20
9 -30
-5
-3
9.8
-3.5
9.6
-4
9.4
-4.5 -5
9 Tim e – µs
Time – µs
4
9.2
C ADJ =10µF
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70
-3.5
10
60
9.8
-2.5
50
-3
10.2 VOUT
40
10
-2
30
-2.5
10.4
10
10.2 VOUT
10.6
VIN
0
-2
-1
-10
-1.5
10.6
10.8
-20
VIN
-0.5
11
-30
Load Current – A
-1
10.8
Load Current – A
-0.5
0
V OUT Deviation – V
0
20
0.3 0.4 0.5 0.6 0.7
0
0.1 0.2
9.98
1.285
10.10
20 CADJ =0µF
1.28 19
10.08
VOUT
V IN Change – V
1.27
V OUT – V
T A = –40°C
1.265 TA =25°C
1.26 T A =125°C
1.255
18
10.06
17
10.04 VIN
16
10.02
15
10.00
14
9.98
V OUT – V
1.275
1.25
65
55
45
35
Tim e – µs
20
10.12
-90
10.10
-80
C ADJ =10µF
19 VOUT
-70
17 10.04
VIN
16
10.02
15
Ripple Rejection – dB
10.06
V OUT – V
10.08
18
V IN = 15 V V OUT = 10 V IOUT = 500 m A TA = 25°C
CADJ =0µF
-60 CADJ =10µF
-50 -40 -30
10.00
-20
Tim e – µs
65
55
45
35
25
15
5
-5
9.98
-15
14
-25
V IN Change – V
25
5
V IN – V
15
-5
-25
40
35
30
25
20
15
10
5
0
1.24
-15
1.245
-10 100
1k
10k
100k
1M
Freque ncy – Hz
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5
-75
-68 -66
-70 -65
-62
Ripple Rejection – dB
Ripple Rejection – dB
-64
-60 -58 -56 -54 -52
V IN = 15 V V OUT = 10 V f = 120 Hz T A = 25°C
-60 -55 -50 V IN – V OUT = 15 V IOUT = 500 m A f = 120 Hz T A = 25°C
-45 -40
IOUT – A
1.5
1.3 1.4
1.2
1
1.1
0.9
0.7 0.8
0.6
0.5
0.4
0.3
0.2
0 0.1
-50
-35 5
10
15
20 V OUT – V
6
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25
30
35
NOTES: A. Ci is not required, but is recommended, particularly if the regulator is not in close proximity to the power-supply filter capacitors. A 0.1- F disc or 1- F tantalum provides sufficient bypassing for most applications, especially when adjustment and output capacitors are used. B. CO improves transient response, but is not needed for stability. C. VO is calculated as shown:
ǒ
V O + V ref 1 )
Ǔ
R2 ) I Adj R1
R2
Because IAdj typically is 50 A, it is negligible in most applications. D. CADJ is used to improve ripple rejection; it prevents amplification of the ripple as the output voltage is adjusted higher. If CADJ is used, it is best to include protection diodes. E. If the input is shorted to ground during a fault condition, protection diodes provide measures to prevent the possibility of external capacitors discharging through low-impedance paths in the IC. By providing low-impedance discharge paths for CO and CADJ, respectively, D1 and D2 prevent the capacitors from discharging into the output of the regulator.
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7
VO is calculated as:
ǒ
Ǔ
R2 ) R3 ) IAdj R2 ) R3 – 10 V R1 Since IAdj typically is 50 A, it is negligible in most applications. V + Vref 1 )
NOTE A: D1 discharges C2 if the output is shorted to ground.
+
8
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(1) Minimum load current from each output is 10 mA. All output voltages are within 200 mV of each other.
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9
NOTE A: RS controls the output impedance of the charger. Z OUT + R S 1 ) R2 R1 The use of RS allows for low charging rates with a fully charged battery.
ǒ
10
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Ǔ
NOTE A: R3 sets the peak current (0.6 A for a 1-
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resistor).
11
NOTES: A. The minimum load current is 30 mA. B. This optional capacitor improves ripple rejection.
12
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www.ti.com
20-Apr-2007
LM317DCY
ACTIVE
SOT-223
DCY
4
80
Green (RoHS & no Sb/Br)
CU SN
Level-2-260C-1YEAR
LM317DCYG3
ACTIVE
SOT-223
DCY
4
80
Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br)
CU SN
Level-2-260C-1YEAR
LM317DCYR
ACTIVE
SOT-223
DCY
4
CU SN
Level-2-260C-1YEAR
LM317DCYRG3
ACTIVE
SOT-223
DCY
4
CU SN
Level-2-260C-1YEAR
LM317KC
NRND
TO-220
KC
3
50
Pb-Free (RoHS)
CU SN
N / A for Pkg Type
LM317KCE3
NRND
TO-220
KC
3
50
Pb-Free (RoHS)
CU SN
N / A for Pkg Type
LM317KCS
ACTIVE
TO-220
KCS
3
50
Pb-Free (RoHS)
CU SN
N / A for Pkg Type
LM317KTER
NRND
PFM
KTE
3
2000
TBD
CU SN
Level-3-240C-168 HR
LM317KTTR
ACTIVE
DDPAK/ TO-263
KTT
3
500
Green (RoHS & no Sb/Br)
CU SN
Level-3-245C-168 HR
LM317KTTRG3
ACTIVE
DDPAK/ TO-263
KTT
3
500
Green (RoHS & no Sb/Br)
CU SN
Level-3-245C-168 HR
2500 Green (RoHS & no Sb/Br)
The marketing status values are defined as follows: Product device recommended for new designs. TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. Device has been announced but is not in production. Samples may or may not be available. TI has discontinued the production of the device. Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. The Pb-Free/Green conversion plan has not been defined. TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
www.ti.com
30-Apr-2007
Pack Materials-Page 1
www.ti.com
LM317KTER
LM317KTER
30-Apr-2007
KTE
KTE
3
SEM
3
0
SEM
0
9.8
333.2
Pack Materials-Page 2
11.0
333.2
2.45
31.75
12
24
NONE
MECHANICAL DATA MPDS094A – APRIL 2001 – REVISED JUNE 2002
NOTES: A. B. C. D.
All linear dimensions are in millimeters (inches). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC TO-261 Variation AA.
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