Besturingssystemen Terminologie van afkortingen PDF

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De terminologie van de te kennen leerstof T1...

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IBM: International Business Machines A-0: Arithmetic Language version 0 FOSS: Free and Open Source Software Mk: Mark, versie ENIAC: Electronic Numerical Integrator and Computer EDVAC: Electronic Discrete Variable Automatic Computer UNIVAC: Universal Automatic Computer COBOL: Common Business Oriented Language CDC: Control Data Corporation IC: Intergrated Circuit TDC: Trombay Digital Computer VLSI: Very-Large-Scale Intergration DEC: Digital Equipment Corporation ULSI: Ultra-Large-Scale Integration AI: Artificial Intelligence Qubit: Quantum Bit QPU: Quentum Processing Unit CRT: Cathode Ray Tube TFT: Thin-Film Transitor LCD: Liquid-Crystal Display Pixel: Picture Element CCFL: Cold-Cathode Fluorescent Lamp LED: Light-Emitting Diode OLED: Organic Light-Emitting Diode Screen burn-in: pixels die lang dezelfde kleur en lichtsterkte hebben blijven permanent in het beeld zichtbaar. XR: Extended Reality MR: Mixed Reality AV: Augmented Virtuality HTTP: Hypertext Transfer Protocol HTTPS: Hypertext Transfer Protocol Secure NAS: Network Attached Storage CPU: Central Processing Unit PDA: Personal Digital Assistant IoT: Internet of things SFF: Small Form Factor Load Balancer: gespecialiseerde server die de belasting gelijkmatig verdeeld over alle beschikbare servers. UPS: Uninterruptible Power Supply. Noodvoeding (accu) die ervoor moet zorgen dat de servers bij een stroomonderbreking verder kunnen werken of op zijn minst veilig kunnen afsluiten PSU: Power Supply Unit PCB: Printed Circuit Board XT: Extended Technology AT:: Advanced Technology ATX: Advanced Technology Extended uATX: Micro Advanced Technology Extended EATX: Extended ATX BTX: Balanced Technology Extended ETX: Embedded Technology Extended ITX: Information Technology Extended MCH: Memory Controller Hub ICH: I/O Controller Hub PCH: Platform Controller Hub LAN: Local Area Network USB: Universal Serial Bus RTC: Real-Time Clock EEPROM: Electrically Erasable Programmable Read-Only Memory BIOS: Basic Input/Output System UEFI: Unified Extensible Firmware Interface

POST: Pwer On Self Test AMI: American Megatrends Fab: semiconductor fabrication plant TSMC: Taiwan Semiconductor Manufacturing Company Limited UMC: United Microelectronics Corporation Silicium: atoomnummer 14, hoofdsbestanddeel van zand en glas Silicon: een soort polymeer met siliciumatomen Downtime en uptime: de tijd waarin de het systeem respectievelijk niet en wel operationeel is. ISA: Instruction Set Architecture CISC: Complex Instruction Set Computer EPIC: : Explicitly Parallel Instruction Computing AMD: Advanced Micro Devices, Inc. ARM: Advanced RISC Machines BBC: British Broadcasting Corporation BGA: Ball Grid Array PGA: Pin Grid Array LGA: Land Grid Array TDP: Thermal Design Power IHS: Integrated Heat Spreader TIM: Thermal Interface Material CU: Contol Unit ALU: Arithmetic Logic Unit IGP: Intergrated Graphics Processor APU: Accelerated Processing Unit GPGPU: General-Purpose Computing on Graphical Processing Units AI: Artificial Intelligence GPU: Graphics Unit NVM: Non-Volatile Memory RAM: Random Acces Memory SIMM: Single IN-Line Memory Module DIMM: Dual In-Line Memory Module SODIMM: Small Outline DIMM SRAM: Static RAM DRAM: Dynamic RAM SDRAM: Synchronous DRAM SDR: Single Date Rate SDRAM DDR: Double Date Rate SDRAM CAS Latency: Column Address Strobe Latency LPDDR: Low Power DDR SGRAM: Synchronous Graphics RAM GDDR: Graphics DDR HBM: High Bandwidth Memory MTD: Magnetic Tape Drive CAC: Compact Audio Cassette MC: Music Cassette LTO: Linear Tape-Open FDD: Floppy Disk Drive ODD: Optical Disc Driver CD: Compact Disc CD-ROM: CD Read-Only Memory CD-R: CD Recordable CD-RW: CD Rewritable DVD: Digital Versatile Disc DVD-ROM: DVD Read-Only Memory DVD-RAM: DVD Random Access Memory DVD-R: DVD Recordable DVD-RW: DVD Rewritable

HD DVD: High Definition DVD BD: Blue-ray Disc BD-ROM: BD Read-Only Memory BD-R: BD Recordable BD-RE: BD Recordable Erasable M-DISC: Millennial Disc MCR: Memory Card Reader SD: Secure Digital MMC: MultiMediaCard SDSC: SD Standard Capacity SDHC: SD High Capacity SDXD: SD Extended Capacity SDUC: SD Ultra Capacity UHS-I: Ultra-High Speed I UHS-II: Ultra-High Speed II UHS-III: Ultra-High Speed III CF: CompactFlash HDD: Hard Disk Drive Tpm: toeren per minuut PMR: Perpendicular Magnetic Recording SMR: Shingled Magnetic Recording SSD: Solid State Drive NAND: Not-AND logic gate QLC: Quad-Level Cel TLC: Triple-Level Cell MLC: Multi-Level Cell eMLC: Enterprise Multi-Level Cell SLC: Single-Level Cell NGFF: Next Generation Form Factor NVMe: Non-Volatile Memory Express SSHD: Solid State Hybrid Drive NAS: Network Attached Storage LAN: Local Area Network IEEE: Institute of Electrical and Electronics Engineers TP: Twisted Pair RJ45: Registered Jack 45 Wi-Fi: Wireless Fidelity SIG: Special Interest Group NFC: Near Field Communication RFID: Radio Frequency Identification GPS: Global Positioning System GLONASS: Global Navigation Satellite System Pixel: Picture Element CRT: Cathode Ray-Tube CGA: Color Graphics Adapter VGA: Video Graphics Array PAL: Phase Alternating Line SD: Standard Definition SVGA: Super Video Graphics Adapter XGA: Extended Graphics Array SXGA: Super Extended Graphics Array HD: High Definition FWXGA: Full Wide XGA FHD: Full HD QHD: Quad HD UHD-1: Ultra HD 1 UHD-2: Ultra HD 2

DCI: Digital Cinema Initiative UWQHD: Ultra-Wide Quad HD TN: Twisted Nematic IPS: In-Plane Switching FFS: Fringe Field Switching VA: Vertical Alignment OLED: Organic Light-Emitting Diode PMOLED: Passive-Matrix OLED AMOLED: Active-Matrix OLED RGB: Red Green Blue RGBa: Red Green Blue Alpha bps: beelden per seconde fps: frames per second CAD: Computer-Aided Design CGI: Computer-Generated Imagery CNC: Computer Numerical Control FDM: Fusion Deposition Modelling SCP: Smooth Curvature Printing SLA: Stereolithography Apparatus DLP: Digital Light Processing LCM: Lithography-based Ceramics Manufacturing LOM: Laminated Object Manufacturing SLS: Selective Laser Sintering DMLS: Direct Metal Laser Sintering SLM: Selective Laser Melting ABS: Acrylonitrile Butadiene Styrene HIPS: High-Impact Polystyrene PA: Polyamide PC: Polycarbonate PVA: Polyvinyl Alcohol FPE: Flexible Polyester PET: Polyethylene Terephthalate PEI: Polyetherimide PPSU: Polyphenylsulfone PCL: Polycaprolactone PLA: Polylactic Acid VGA: Video Graphics Array DVI: Digital Visual Interface DVI-A: DVI Analog DVI-I: DVI Integrated DVI-D: DVI Digital HDMI: High-Definition Multimedia Interface DP: DisplayPort...