Title | S08 Semiconductor Devices |
---|---|
Author | Luis Mora |
Course | Electronic Engineering Fundamentals |
Institution | Universidad Carlos III de Madrid |
Pages | 29 |
File Size | 1.7 MB |
File Type | |
Total Downloads | 83 |
Total Views | 161 |
Lecture on semiconductors...
Electronics Engineering Fundamentals Bachelor’s Degree in Aerospace Engineering Semiconductor devices
Electronics Technology Department
Outline • Semiconductorfundamentals • Semiconductordevices • Diode • TransistorMOSFET
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Semiconductor fundamentals • Solidswithcrystallinestructurespresentspecialproperties • Siliconisoneofthemostusedsemiconductormaterials T=0ºK
ElectronicsEngineeringFundamentals
How do electrons move along the lattice?
T > 0ºK
3
Semiconductor fundamentals • Energylevels Bandstructure.Availableenergylevelsfor crystallinesolidsthatarenotforsingleatoms • Valenceband • Conductionband • Bandgap Semiconductors have band-gaps around 1 eV Conductor
Insulator
Semiconductor
E
E
E
CB CB
CB Eo VB
Eo
GAP
Eo
VB VB
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Semiconductor fundamentals • Conductors: Conduct electricity They have free electrons not linked to atoms Allows the formation of metallic joints. E.g.: Copper • Insulators: Do not conduct electricity Do not have free electrons Share their electrons by covalence joints. • Semiconductors: Half way between conductors and insulators They conduct when they have free charges (negative or positive charge carriers) Intrinsic or Extrinsic semiconductors
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Semiconductor fundamentals • Extrinsicsemiconductors:Addingimpuritiestoincreasethe carriers TYPE n: Substitution of atoms in the crystal with atoms with one electron more in the valence band.
TYPE p: Substitution of atoms in the crystal with atoms with one electron less in the valence band.
Ie: Phosfor (P). DONOR Atom
Ie: Boron (B). ACCEPTOR Atom
e- : Majority carriers h+ : Minority carriers
ElectronicsEngineeringFundamentals
T=0ºK
h+ : Majority carriers e- : Minority carriers
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Semiconductor devices • Electronics is based on using semiconductor devices • These devices present different behaviours depending on their operating conditions. • Advanced manufacturing process for integrated devices. • Diodes • Transistors
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Diode
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Diode • PNjunction
+
P
Free charge: h+
+ -+ - + -+ -+- + -
– –+ –+ –+ –+ –+ –+ N
-
+
Fixed charge
Free charge: e-
Depletion region (no free majority carriers due to recombination)
E +
Volts
At equilibrium No overall current
-
Potential barrier ElectronicsEngineeringFundamentals
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Diode Forward bias
• PNjunction P
+ -+ - + -+ -+- + -
P
N
-
+
Fixed charge
–+ –+ –+ –+ –+ –+
N
+++ – – – + + + +I – – – – +++ – – – D
+-
Free charge
Net current flow, ID
E
+ +
Volts
-
Volts Potential barrier
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-
Potential barrier 10
Diode • PNjunction
Reversebias
P
+ -+ - + -+ -+- + -
P
N
-
+
Fixed charge
–+ –+ –+ –+ –+ –+
+ - + +
N
+-
– –+ – Free charge
NO current flow
E
Volts
+
-
+
Volts Potential barrier
ElectronicsEngineeringFundamentals
-
Potential barrier 11
Diode • Twoterminalsemiconductor • Allowthecurrentflowinonedirection:Anode
Cathode
Metallic Contacts
p
STRUCTURE
SYMBOL
id
n
Cathode
Anode
+
vd
-
PACKAGING Anode
ElectronicsEngineeringFundamentals
Cathode
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Diode - model • Idealmodel 1ª Approximation: Ideal Diode
id
Equivalent Circuit
A <
Reversebias ON
C
ID
Cathode
Anode
vd=0
+
id>0
Si VD > 0 => ON
vD
-
vd OFF Equivalent Circuit
A
C
id=0
SHORTCIRCUIT
Forward bias Si VD < 0 => OFF
OPEN CIRCUIT
vd 0 => ON
+ V -
ON
vd=V id>0 V
OFF Equivalent Circuit
A
vd DATASHEET
Constant DC voltage drop (V)
Si VD < 0 => OFF OPEN CIRCUIT
C
id=0 vd Vt
VDS
VGS
N
If VGS >>> Vt
IS S
IG = 0
ID = IS
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NMOS 22
MOSFET - model • EquivalentCircuitModel:n‐channelMOSFET Saturation region
𝐼 𝑉 𝑉
Cutoff region
𝐼 0 BiasPoint=OperatingPoint VGS,VDS,ID ElectronicsEngineeringFundamentals
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MOSFET - applications • Amplifiers Input signal vgs Small Signal (AC)
vds
Output signal
Bias (DC)
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MOSFET - applications • Amplifiers vi+ vi-
VCC
vo
+ _
𝑇𝐿082 VEE
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MOSFET - applications • Switch:Fixingcurrent
Lamp / Motor
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Forsituations whereVindoes notprovide currentenough foryourload
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MOSFET - applications • Switch:Digitalcircuits • Saturation • Cut‐off
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MOSFET – Bias point (operating point) 1. Assumethetransistorisworkinginsaturation(ID constant) 2. Applysaturationequations 𝐼 𝑉 𝑉 VGS≥Vt
IG= 0 NMOS
3. Usecircuitanalysistechniques(Kirchhoff’sLaws) 4. Determinecurrentsandvoltages 5. Checktransistorisactuallyworkinginsaturation VDS≥VGS +Vt
ElectronicsEngineeringFundamentals
NMOS
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MOSFET – Example VGG =2V,RG =2.5MΩ ,VDD=5V,RD =2kΩ k=0.5mA/V2 Vt=1V
RD RG +
VGG
IG + VGS -
ID + VDS -
+ -
VDD
-
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