Datasheet HC Final PDF

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Summary

Download Datasheet HC Final PDF

Description

74HC74 Dual D Flip−Flop with Set and Reset −Performance Silicon−Gate CMOS

High

The 74HC74 is identical in pinout to the LS74. The device inputs are

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compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs.

MARKING

−flops with individual Set, Reset, a D−input is transferred to the

This device consists of two D flip and Clock inputs. Information at

DIAGRAMS

corresponding Q output on the next positive going edge of the clock

−flop. The Set

input. Both Q and Q outputs are available from each flip

14

and Reset inputs are asynchronous.

−14

SOIC 14

• • • • • • • • •

HC74G

D SUFFIX

Features

AWLYWW

CASE 751A

1

Output Drive Capability: 10 LSTTL Loads

1

Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 2.0 to 6.0 V Low Input Current: 1.0

14

mA 14

High Noise Immunity Characteristic of CMOS Devices In Compliance with the JEDEC Standard No. 7A Requirements ESD Performance: HBM

−14

HC

TSSOP

74

DT SUFFIX

ALYW

CASE 948G

1

G

G 1

> 2000 V; Machine Model > 200 V

Chip Complexity: 128 FETs or 32 Equivalent Gates

−Free Packages are Available

Pb

HC74

= Device Code

A

= Assembly Location

L, WL

= Wafer Lot

Y

= Year

W, WW G or

G

= Work Week = Pb

−Free Package

(Note: Microdot may be in either location)

ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet.

©

Semiconductor Components Industries, LLC, 2007

February, 2007

− Rev. 0

1

Publication Order Number: 74HC74/D

74HC74

PIN ASSIGNMENT

LOGIC DIAGRAM

RESET 1

RESET 1

1

14

VCC

DATA 1

2

13

RESET 2

CLOCK 1

3

12

DATA 2

SET 1

4

11

CLOCK 2

Q1

5

10

SET 2

Q1

6

9

Q2

GND

7

8

Q2

DATA 1 CLOCK 1 SET 1 RESET 2 DATA 2 FUNCTION TABLE

CLOCK 2 Inputs

1 2

5

3

6

Q1 Q1

4 13 12

9

11

8

Q2 Q2

Outputs

Set

Reset

Clock

Data

Q

Q

L

H

X

X

H

L

H

L

X

X

L

H

L

L

X

X

H*

H*

H

H

H

H

L

H

H

L

L

H

SET 2

10 PIN 14 = VCC PIN 7 = GND

H

H

L

X

No Change

H

H

H

X

No Change

H

H

X

No Change

*Both outputs will remain high as long as Set and Reset are low, but the output states are unpredictable if Set and Reset go high simultaneously.

MAXIMUM RATINGS Symbol VCC Vin Vout Iin Iout

Parameter

Value

Unit

– 0.5 to + 7.0

V

DC Input Voltage (Referenced to GND)

– 0.5 to VCC + 0.5

V

DC Output Voltage (Referenced to GND)

– 0.5 to VCC + 0.5

V

DC Input Current, per Pin

±20

mA

DC Output Current, per Pin

±25

mA

DC Supply Voltage (Referenced to GND)

ICC

DC Supply Current, VCC and GND Pins

PD

Power Dissipation in Still Air,

Tstg TL

±50

SOIC Package†

500

TSSOP Package†

450

Storage Temperature

device

mA

protection

due to high static voltages or electric

be taken to avoid applications of any voltage higher than maximum rated

−impedance cir-

voltages to this high

cuit. For proper operation, Vin and Vout should be constrained to the range GND Unused

_C _C

Lead Temperature, 1 mm from Case for 10 Seconds

contains

fields. However, precautions must

mW

– 65 to + 150

(SOIC or TSSOP Package)

This

circuitry to guard against damage

v (Vin or inputs

Vout)

must

v

VCC.

always be

tied to an appropriate logic voltage level

(e.g.,

either

GND

or

VCC).

Unused outputs must be left open.

260 300

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. †Derating

_

— SOIC Package: – 7 mW/ C from 65 TSSOP Package:

−

_

_

to 125 C

_

6.1 mW/ C from 65

_

_

to 125 C

For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High

RECOMMENDED OPERATING CONDITIONS Symbol VCC Vin, Vout

Parameter DC Supply Voltage (Referenced to GND)

Min

Max

2.0

6.0

V

0

VCC

V

DC Input Voltage, Output Voltage (Referenced to GND)

– 55

+ 125

_C

VCC = 2.0 V

0

1000

ns

TA

Operating Temperature, All Package Types

tr, tf

Input Rise and Fall Time (Figures 1, 2, 3)

Unit

VCC = 3.0 V

0

600

VCC = 4.5 V

0

500

VCC = 6.0 V

0

400

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−Speed

CMOS Data Book (DL129/D).

74HC74

DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) Guaranteed Limit

Symbol VIH

Parameter Minimum High

Test Conditions

−Level Input

Vout = 0.1 V or VCC – 0.1 V

Voltage

|Iout|

−Level Input

VIL

Maximum Low

Vout = 0.1 V or VCC – 0.1 V

Voltage

VOH

|Iout|

Minimum High

v 20 mA

−Level Output

v 20 mA

Vin = VIH or VIL

Voltage

|Iout|

v 20 mA

Vin = VIH or VIL

−Level Output

VOL

Maximum Low

Vin = VIH or VIL

Voltage

|Iout|

v 20 mA

Vin = VIH or VIL

Iin ICC

v 2.4 mA |Iout| v 4.0 mA |Iout| v 5.2 mA |Iout|

v 2.4 mA |Iout| v 4.0 mA |Iout| v 5.2 mA |Iout|

VCC

– 55 to

(V)

25 C

v 85_C

v 125_C

Unit

2.0

1.5

1.5

1.5

V

3.0

2.1

2.1

2.1

4.5

3.15

3.15

3.15

6.0

4.2

4.2

4.2

2.0

0.5

0.5

0.5

3.0

0.9

0.9

0.9

4.5

1.35

1.35

1.35

6.0

1.8

1.8

1.8

2.0

1.9

1.9

1.9

4.5

4.4

4.4

4.4

_

6.0

5.9

5.9

5.9

3.0

2.48

2.34

2.2

4.5

3.98

3.84

3.7

6.0

5.48

5.34

5.2

2.0

0.1

0.1

0.1

4.5

0.1

0.1

0.1

6.0

0.1

0.1

0.1

3.0

0.26

0.33

0.4

4.5

0.26

0.33

0.4

6.0

0.26

0.33

Maximum Input Leakage Current

Vin = VCC or GND

6.0

±0.1

±1.0

Maximum Quiescent Supply

Vin = VCC or GND

6.0

2.0

20

Current (per Package)

Iout = 0

V

V

V

0.4

±1.0 80

mA mA

mA

NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High

−Speed

CMOS Data Book

(DL129/D).

AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6.0 ns) Guaranteed Limit

Symbol fmax

Parameter Maximum Clock Frequency (50% Duty Cycle) (Figures 1 and 4)

tPLH,

(Figures 1 and 4)

tPHL

tPLH,

tTLH,

Cin

Maximum Propagation Delay, Set or Reset to Q or Q (Figures 2 and 4)

tPHL

tTHL

Maximum Propagation Delay, Clock to Q or Q

Maximum Output Transition Time, Any Output (Figures 1 and 4)

Maximum Input Capacitance

VCC

– 55 to

(V)

25 C

v 85_C

v 125_C

Unit

2.0

6.0

4.8

4.0

MHz

3.0

15

10

8.0

4.5

30

24

20

6.0

35

28

24

2.0

100

125

150

3.0

75

90

120

4.5

20

25

30

6.0

17

21

26

2.0

105

130

160

3.0

80

95

130

4.5

21

26

32

6.0

18

22

27

2.0

75

95

110

3.0

30

40

55

4.5

15

19

22

6.0

13

16

19

—

10

10

10

_

ns

ns

ns

pF

NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ON Semiconductor High

−Speed

CMOS Data Book (DL129/D).

°

Typical @ 25 C, VCC = 5.0 V CPD

Power Dissipation Capacitance (Per Flip

−Flop)*

32

−load dynam ic power consumption: PD = CPD VCC −Speed CMOS Data Book (DL129/D).

* Used to determine the no ON Semiconductor High

2

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pF

f + ICC VCC . For load considerations , see Chapter 2 of the

74HC74

TIMING REQUIREMENTS (Input tr = tf = 6.0 ns) Guaranteed Limit

Symbol tsu

Parameter Minimum Setup Time, Data to Clock (Figure 3)

th

Minimum Hold Time, Clock to Data (Figure 3)

trec

Minimum Recovery Time, Set or Reset Inactive to Clock (Figure 2)

tw

Minimum Pulse Width, Clock (Figure 1)

tw

Minimum Pulse Width, Set or Reset (Figure 2)

tr, tf

Maximum Input Rise and Fall Times (Figures 1, 2, 3)

VCC

– 55 to

(V)

25 C

v 85_C

2.0

80

100

120

3.0

35

45

55

4.5

16

20

24

6.0

14

17

20

2.0

3.0

3.0

3.0

3.0

3.0

3.0

3.0

4.5

3.0

3.0

3.0

6.0

3.0

3.0

3.0

2.0

8.0

8.0

8.0

3.0

8.0

8.0

8.0

4.5

8.0

8.0

8.0

6.0

8.0

8.0

8.0

2.0

60

75

90

3.0

25

30

40

4.5

12

15

18

6.0

10

13

15

2.0

60

75

90

3.0

25

30

40

4.5

12

15

18

6.0

10

13

15

2.0

1000

1000

1000

3.0

800

800

800

4.5

500

500

500

6.0

400

400

400

_

v 125_C

Unit ns

ns

ns

ns

ns

ns

ORDERING INFORMATION Device

Package

Shipping

†

−14

74HC74D

SOIC

74HC74DG

−14 −Free)

SOIC (Pb

55 Units / Rail

−14

74HC74DR2

SOIC

74HC74DR2G

SOIC (Pb

−14 −Free)

2500 / Tape & Reel

−14*

74HC74DTR2

TSSOP

74HC74DTR2G

TSSOP

−14*

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb

−Free.

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74HC74

SWITCHING WAVEFORMS

tf CLOCK

tw

tr VCC

90% 50% 10% tw

SET OR RESET

GND

Q or Q

GND t PHL 50%

Q OR Q

1/fmax t PLH

t PHL

t PLH

90% 50% 10%

50%

Q OR Q t TLH

VCC

50%

t THL

VCC 50%

CLOCK

GND Figure 2.

Figure 1.

TEST POINT

VALID VCC DATA

OUTPUT

50% DEVICE UNDER TEST

GND t su

t rec

th VCC

CL*

50% GND

CLOCK

*Includes all probe and jig capacitance

Figure 4.

Figure 3.

SET

4, 10

2, 12

5, 9

DATA

Q

3, 11 CLOCK

6, 8 Q

1, 13 RESET

Figure 5. EXPANDED LOGIC DIAGRAM

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74HC74

PACKAGE DIMENSIONS

SOIC

−14 −03

CASE 751A

ISSUE H

NOTES: 1. DIMENSIONING AND TOLERANCING PER

−A−

ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER.

14

3. DIMENSIONS A AND B DO NOT INCLUDE

8

MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.

−B−

P

5. DIMENSION D DOES NOT INCLUDE

7 PL

DAMBAR PROTRUSION. ALLOWABLE

0.25 (0.010) M

B

M

DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL

7

1

CONDITION.

G

MILLIMETERS

R

C

X 45

F

_

DIM

MAX

A

8.55

8.75

0.337

0.344

B

3.80

4.00

0.150

0.157

C

−T − SEATING PLANE

D

0.25 (0.010)

M

K

14 PL

M

T B

J

S

A

0.014

0.019

0.016

0.049

1.27 BSC 0.19 0.10 0

_

0.050 BSC

0.25 0.25 7

_

0.008 0.004 0

_

0.009 0.009 7

_

P

5.80

6.20

0.228

0.244

R

0.25

0.50

0.010

0.019

SOLDERING FOOTPRINT* 7X

14X

1.52 1 14X

0.58

1.27 PITCH

DIMENSIONS: MILLIMETERS

−Free strategy and soldering

*For additional information on our Pb

details, please download the ON Semiconductor Soldering and

6

0.068

0.49 1.25

M

http://onsemi.com

0.054

0.35 0.40

J

Mounting Techniques Reference Manual, SOLDERRM/D.

1.75

MAX

F

K

7.04

1.35

MIN

D

G

S

INCHES

MIN

74HC74

PACKAGE DIMENSIONS

−14 −01

TSSOP

CASE 948G

ISSUE B

NOTES: 14X

K

1.

REF

DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

0.10 (0.004) 0.15 (0.00...